Triac electronics check suppliers according to the certifications, trade references, and team size. We also consider supplier’s inventory, Scale , and other aspects when choosing suppliers.
Triac perform further checks even for pre-screened suppliers. We drew up professional interior suppliers’ systems of grading by using ISO9001:2015 as our standard. We rate quality, delivery, quantity and delivery circles according to the ISO standard. We screen out our suppliers by month, quarter and year according to different levels.
Triac appoints special purchasers who manage our suppliers point-to-point construction. Our purchasers will take random spot checks, communicate with our suppliers, visit our suppliers and turn in our supplier's accurate and detailed reports. All of our suppliers are on file by the end of the process.
The spectrometer is used far measuring the controlled elements in lead-free and RoHS compliant devices and determining the composition of plating materials. We also use this equipment for helping to detect reconditioned and resurfaced parts by measuring the plating thickness and variations in the composition of the surface material.
The first, and most essential step for any component evaluation is visual inspection process. The procedure and acceptance standards have been developed in order to detect and report evidence of remarking, resurfacing, and refurbishing marking permanency. Resistance to solvents, resurfacing, dimension verification, marking code matching, high-power magnification inspection of body and terminal condition are standard methods within our inspection process. All inspections and observations are reviewed by Quality Engineers to evaluate whether we are seeing a new counterfeiting technique.
A destructive test that removes the insulation material of the component to reveal the die. The die is then analyzed for markings and architecture to determine traceability and authenticity of the device, Magnification power of up to 1,000x is necessary to identify die markings and surface anamolies. Qur decapsulation report includes analysis of the die markings and topography to clarify what is verified versus still unverified about a device. We do not only send images and leave the analysis up to you.
This is not a counterfeit detection method as oxidation occurs naturally; however, itis a significant issue for functionality and is particularly prevalent in hat, humid climates such as Southeast Asia and the southern states in North America. The joint standard J-STD-002 defines the test methods and accept/reject criteria for thru-hole, surface mount, and BGA devices. For non-BGA surface mount devices, the dip-and-look is employed and the “ceramic plate test” for BGA devices has recently been incorporate inta cur suite of services. Devices that are delivered in inappropriate packaging, acceptable packaging but are aver one year old, or display contamination on the pins are recommended for solderability testing.
This is not a counterfeit detection method as oxidation occurs naturally; however, itis a significant issue for functionality and is particularly prevalent in hat, humid climates such as Southeast Asia and the southern states in North America. The joint standard J-STD-002 defines the test methods and accept/reject criteria for thru-hole, surface mount, and BGA devices. For non-BGA surface mount devices, the dip-and-look is employed and the “ceramic plate test” for BGA devices has recently been incorporate inta cur suite of services. Devices that are delivered in inappropriate packaging, acceptable packaging but are aver one year old, or display contamination on the pins are recommended for solderability testing.
This is not a counterfeit detection method as oxidation occurs naturally; however, itis a significant issue for functionality and is particularly prevalent in hat, humid climates such as Southeast Asia and the southern states in North America. The joint standard J-STD-002 defines the test methods and accept/reject criteria for thru-hole, surface mount, and BGA devices. For non-BGA surface mount devices, the dip-and-look is employed and the “ceramic plate test” for BGA devices has recently been incorporate inta cur suite of services. Devices that are delivered in inappropriate packaging, acceptable packaging but are aver one year old, or display contamination on the pins are recommended for solderability testing.
Functional tests measure published datasheet or source control document specifications including DC & AC parameters. DC test parameters are typically specified in Volts, Amps or Ohms. DC Testing insures proper device operation - acceptable power consumption, basic functionality, verifies data sheet parameters, etc. It provides a reasonable Cost/Benefit trade-off when at least one data sheet parameter needs to be measured to verify functionality. AC test parameters are typically specified in time or frequency (nS, MHz, etc.). AC Testing measures device speed/performance using a periodic signal or clocked test vectors. Combined DC & AC testing provides the most reliable test results and include a comprehensive set of parameters to verify device functionality. AAA can perform all functional testing over temperatures ranging from -65°C to +150°C to verify device performance to manufacturer's data sheet specifications. This capability allows us to upscreen devices to a faster speed grade or wider temperature range.
After receiving the materials from logistics team, our warehouse staff makes a visual checking of manufacturers’ trademark, part number, lot number, quantity, label, and package.Then they use instruments to verify Original label print and marking, once everything gets verified, it will be approved into our warehouse and make photos records.
We are committed to diligently following the quality standard requirements.With leading solutions to ensure the integrity of authentic components and the stability of manufactured electronics.